plating
英 [ˈpleɪtɪŋ]
美 [ˈpleɪtɪŋ]
n. 镀层(镀在金属上的其他金属薄层); 外层; (尤指)金属板护层
v. 电镀(尤指镀金、镀银); 为…加设护板; (用金属板等)覆盖
plate的现在分词
现在分词：plating
BNC.25067 / COCA.22601
牛津词典
noun
- 镀层（镀在金属上的其他金属薄层）
a thin covering of a metal, especially silver or gold, on another metal - 外层；（尤指）金属板护层
a layer of coverings, especially of metal plates- armour plating
装甲敷板
- armour plating
柯林斯词典
- N-UNCOUNT （金属）镀层；外覆的金属板
Platingis a thin layer of metal on something, or a covering of metal plates.- The tanker began spilling oil the moment her outer plating ruptured.
油轮外部金属板覆层破裂的那一瞬间，油开始外溢。
- The tanker began spilling oil the moment her outer plating ruptured.
英英释义
noun
- the application of a thin coat of metal (as by electrolysis)
- a thin coating of metal deposited on a surface
双语例句
- Meanwhile this paper also investigated the relationship between chromium plating and oxidation resistance of cast iron.
同时还研究了试样表面镀铬与其抗氧化性之间的关系。 - Rotating disk electrode system is used to study the coating roughness in high-speed zinc plating.
将旋转圆盘电极体系应用于高速镀锌层粗糙度的研究。 - So the research and development of electroless plating nickel have great significance.
因此，对化学镀镍的研究和开发具有重要意义。 - A new process of electroless tin plating was studied, and half-bright and silvery-white tin coating is obtained.
通过反复试验，研究了一种新型的化学镀锡工艺，获得了半光亮银白色的镀锡层。 - Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced.
介绍了晶纹镀锡中重熔工序的操作要点和安全要求。 - Because it is a good plating layers of titanium and therefore will never decolorization.
因为是镀了好几层钛金的，因此永远也不会脱色。 - A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。 - The common electroless processes for plating different metals and alloys on ceramic surface and their pretreatment are presented.
本文论述了常用的陶瓷表面镀覆不同金属、合金的化学镀及其前处理工艺。 - The process flow of electroless nickel plating on the surface of polyacrylonitrile-based carbon fiber was introduced.
介绍了聚丙烯腈基碳纤维表面化学镀镍的工艺流程，前处理包括去胶、除油、粗化、中和、敏化、活化和还原。 - A new copper plating bath for electroless deposition directly on conductive copper-diffusion barrier layers has been developed.
一种可以直接在传导性铜扩散阻挡层非电镀沉积的新的铜镀液已经被发现了。